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Description
Application Scenarios
A packaging facility operates a high-speed cartoning line controlled by an SLC 500 processor with numerous analog inputs for temperature and pressure monitoring, plus digital I/O for actuators and sensors. The existing 10-slot chassis has reached full capacity, leaving no room for additional modules required by a planned line upgrade.
The engineering team installs a 1746-A13 as the primary chassis, consolidating the processor, power supply, and all existing I/O modules into a single 13-slot rack. The extra capacity accommodates new analog input modules for temperature monitoring and a communication module for connecting to the plant’s EtherNet/IP network. Because the 1746-A13 uses the same backplane architecture as the original chassis, existing wiring and programming remain unchanged. The packaging line upgrade proceeds without downtime, and the centralized rack simplifies future maintenance by keeping all critical modules in one accessible location.
Parameter
| Main Parameters | Value/Description |
|---|---|
| Product Model | 1746-A13 |
| Manufacturer | Allen-Bradley / Rockwell Automation |
| Product Category | PLC Chassis / I/O Rack |
| Product Family | SLC 500 |
| Number of Slots | 13 (1 for power supply, 12 for processor/I/O/communication modules) |
| Backplane Current | 5.1V DC @ 10A; 24V DC @ 2.88A |
| Dimensions (W×H×D) | 502 mm × 171 mm × 145 mm |
| Weight | 1.9 kg (4.2 lbs) |
| Mounting Type | Panel Mount (8 mounting tabs) |
| Cooling | Passive convection |
| Operating Temperature | 0°C to +60°C |
| Storage Temperature | -40°C to +85°C |
Technical Principles and Innovative Values
Innovation Point 1: Modular Architecture for Flexible System Configuration. The 1746-A13 provides thirteen slots that can accommodate any combination of SLC 500 modules, including processors, digital and analog I/O, communication interfaces, and specialty cards. Modules can be placed in any position within the chassis, allowing engineers to optimize layout for wiring convenience and thermal management. This flexibility enables a single chassis to serve applications ranging from simple I/O concentration to complex multi-axis control systems.
Innovation Point 2: Integrated Backplane Power Distribution. The 1746-A13 backplane distributes power to all installed modules from the chassis power supply. With a maximum capacity of 10A at 5.1V DC and 2.88A at 24V DC, the chassis supports a full complement of high-density modules without requiring external power wiring to individual cards. This centralized power architecture simplifies cabinet wiring and reduces installation time.
Innovation Point 3: Passive Convection Cooling for Reliability. The 1746-A13 employs passive convection cooling, eliminating the need for cooling fans within the chassis. This design reduces moving parts, lowers maintenance requirements, and prevents dust ingress that can occur with forced-air cooling. The chassis operates reliably in ambient temperatures from 0°C to +60°C without derating.
Innovation Point 4: Rack Extension Capability for Distributed Systems. Multiple 1746-A13 chassis can be interconnected using rack extension cables such as the 1746-C7, enabling expansion beyond a single rack. Systems can support up to three chassis or 30 total slots, providing scalability for large distributed I/O applications. This capability allows incremental system growth without replacing existing hardware.
