Product Overview

The ABB 5SDF1045H0002 is a high-performance,press-pack type IGBT(Insulated Gate Bipolar Transistor)power semiconductor module,engineered for use in medium-to high-power industrial and energy applications such as medium-voltage drives,wind turbine converters,traction systems,and flexible AC transmission systems(FACTS).As part of ABB’s advanced StakPak™IGBT family,the ABB 5SDF1045H0002 leverages press-pack technology—where electrical and thermal contacts are established through mechanical pressure rather than soldering or wire bonds—to deliver exceptional reliability,high current density,and superior ruggedness under extreme electrical and thermal cycling conditions.

This device is specifically designed for applications demanding high efficiency,low switching losses,and long operational life in harsh environments.The absence of bond wires eliminates a common failure point in conventional modules,while the symmetric,low-inductance internal structure enables clean switching waveforms and reduced electromagnetic interference(EMI).With its robust ceramic housing and integrated gate resistor,the ABB 5SDF1045H0002 supports easy paralleling and scalable inverter design—making it a preferred choice in multi-megawatt power conversion systems where uptime and serviceability are critical.

Technical Specifications

Parameter Name Parameter Value

Product Model 5SDF1045H0002

Manufacturer ABB Semiconductors

Device Type Press-Pack IGBT(StakPak™)

Configuration Single-switch(one IGBT+anti-parallel diode)

Collector-Emitter Voltage(VCE)4,500 V(blocking voltage)

Continuous Collector Current(IC)1,050 A 85°C case temperature

Peak Pulsed Current Up to 2,100 A(short duration)

Gate-Emitter Voltage(VGE)±20 V(max)

Switching Frequency Up to 1 kHz(typical for MV applications)

Junction Operating Temperature–40°C to+150°C

Thermal Resistance(Rth(j-c))~0.015 K/W(very low,due to press-pack design)

Package Type StakPak™cylindrical press-pack

Mounting Clamped between heatsinks in a pressurized stack

Isolation No baseplate;isolation provided by external cooling system

Main Features and Advantages

Press-Pack Reliability:Unlike traditional welded or bonded IGBTs,the ABB 5SDF1045H0002 uses direct copper-to-ceramic contact under uniform pressure,enabling excellent thermal cycling performance(>100,000 cycles)and fail-safe behavior—under fault conditions,the device typically fails into a short circuit rather than an open circuit,allowing protective systems time to react safely.

High Power Density&Scalability:The compact cylindrical form factor allows dense stacking in series/parallel configurations for multi-level converters(e.g.,NPC or MMC topologies).This modularity simplifies thermal management and enables standardized inverter building blocks for wind or rail applications.

Low Inductance&EMI:Symmetrical internal layout minimizes parasitic inductance(<20 nH),reducing voltage overshoot during turn-off and enabling cleaner switching—critical for protecting insulation in medium-voltage motor drives and transformers.

Integrated Gate Resistor:Factory-installed gate resistor ensures consistent switching performance and simplifies external gate driver design,improving system reproducibility across production units.

Application Field

The ABB 5SDF1045H0002 is primarily deployed in multi-megawatt power electronics systems requiring high blocking voltage and robust operation:

Wind Energy:Used in full-power back-to-back converters for offshore wind turbines(3–7 MW range),where reliability and service intervals exceeding 20 years are mandated.

Rail Traction:Powers main inverters in locomotives and high-speed trains,handling regenerative braking and catenary voltage fluctuations.

Medium-Voltage Drives(MVD):Core switching element in ABB’s ACS1000/ACS6000 drives for pumps,compressors,and mills in oil&gas,mining,and water industries.

HVDC&FACTS:Employed in STATCOMs and VSC-HVDC converter valves for grid stabilization and renewable integration.

Industrial Furnaces&Rolling Mills:Provides precise power control in high-current,cyclic-load applications.

Due to its rugged construction and proven field history,the ABB 5SDF1045H0002 remains a benchmark in high-power IGBT technology—even as newer SiC devices emerge,this silicon-based press-pack IGBT continues to dominate in cost-sensitive,ultra-reliable megawatt-scale systems.

Related Products

5SDF1060H0002:Higher-current variant(1,500 A)with same 4.5 kV rating.

5SDF1045H0003:Version with different gate resistance or testing protocol.

5SNA1045H0002:Older generation(non-StakPak)wire-bonded IGBT—less robust than 5SDF1045H0002.

IGBT Driver AGD1000:Compatible ABB gate driver unit optimized for StakPak modules.

StakPak Cooling Assembly:Custom liquid-cooled heat sink stacks used in ABB inverter cabinets.

ABB ACS6000 Drive System:Medium-voltage drive platform that commonly integrates this IGBT.

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