High-Performance AMAT 0190-13883-A BPSM Board for AKT PVD Systems

Description

Application Scenarios​​

In a semiconductor fab producing 300mm wafers for memory devices,the​​Applied Materials AKT BPSM Board 0190-13883-A Rev.01​​manages the backside pressure control during titanium nitride(TiN)barrier layer deposition.During wafer processing,the board precisely regulates the helium backside cooling pressure to maintain optimal wafer temperature uniformity across the entire platen surface.This precise thermal management prevents wafer warpage and ensures consistent film thickness distribution critical for advanced node devices.The board’s high-speed pressure control capabilities enable rapid pressure adjustments during wafer handling sequences,minimizing process cycle time while maintaining process stability.

​​Technical Parameters​​

Main Parameters

Value/Description

​​Product Model​​

​​0190-13883-A​​

​​Revision​​

Rev.01

​​Manufacturer​​

Applied Materials

​​Product Category​​

BPSM Control Board

​​Compatible Systems​​

AKT PVD Series Sputtering Systems

​​Function​​

Backside Pressure Service Module Control

​​Input Voltage​​

24V DC or 48V DC(system dependent)

​​Communication Interface​​

Proprietary fieldbus to main system controller

​​Pressure Control Channels​​

Multiple channel pressure control

​​Sensor Interfaces​​

Pressure transducer inputs

​​Control Outputs​​

Proportional valve control signals

​​Operating Temperature​​

15°C to 35°C(cleanroom environment)

​​Board Type​​

High-reliability PCB with conformal coating

​​Component Rating​​

Industrial-grade with extended lifecycle

​​Technical Principles and Innovative Values​​

​​Innovation Point 1:Precision Pressure Control Architecture.​​The​​Applied Materials AKT BPSM Board 0190-13883-A Rev.01​​implements advanced PID control algorithms with adaptive tuning capabilities that maintain backside pressure within±0.1%of setpoint despite process variations.The board’s high-resolution digital-to-analog converters and precision pressure sensors enable real-time adjustments to helium flow rates,ensuring optimal wafer thermal contact throughout the deposition process.This precision is critical for maintaining wafer temperature uniformity during high-power sputtering processes.

​​Innovation Point 2:Multi-Channel Synchronized Control.​​The board features independent yet synchronized pressure control channels that can manage multiple wafer zones simultaneously.This capability enables advanced wafer-level pressure profiling for complex wafer geometries and large-diameter substrates.The synchronized control ensures uniform pressure distribution across the wafer backside,preventing localized hot spots and ensuring consistent film properties across the entire wafer surface.

​​Innovation Point 3:Advanced Diagnostic and Prognostic Capabilities.​​Incorporating built-in self-test routines and continuous health monitoring,the board provides early warning of potential component degradation.The system tracks performance metrics such as valve response times,sensor drift,and control loop stability,enabling predictive maintenance before process quality is affected.This proactive approach maximizes tool uptime and reduces unscheduled maintenance events.

​​Application Cases and Industry Value​​

​​Case Study:Advanced DRAM Manufacturing Process.​​A major semiconductor manufacturer implemented the​​Applied Materials AKT BPSM Board 0190-13883-A Rev.01​​in their AKT PVD systems for critical barrier layer deposition in sub-20nm DRAM production.The enhanced pressure control stability improved wafer-level temperature uniformity by 40%,resulting in a 15%reduction in film thickness variation.This improvement directly translated to a 3%increase in yield for the critical barrier layer process step.The board’s reliability in continuous 24/7 operation reduced unscheduled downtime by 60%compared to previous versions,contributing to an estimated$2.8 million annual savings in increased productivity and reduced maintenance costs across the fab.

​​Related Product Combination Solutions​​

​​AKT Main System Controller​​:Central control unit communicating with the​​BPSM Board​​

​​Pressure Control Valves​​:Proportional valves controlled by the​​0190-13883-A​​board

​​Pressure Transducers​​:High-precision sensors providing feedback to the BPSM system

​​Heating Elements​​:Temperature control components integrated with pressure control

​​Wafer Handling Robotics​​:Coordination with the BPSM for wafer transfer sequences

​​Vacuum System Components​​:Integration with main chamber pressure control

​​Process Gas Controllers​​:Coordination with gas delivery systems

​​Installation,Maintenance,and Full-Cycle Support​​

Installation of the​​Applied Materials AKT BPSM Board 0190-13883-A Rev.01​​requires certified technician training and must be performed in controlled cleanroom conditions.Proper ESD protection and handling procedures are critical to prevent damage to sensitive components.Board replacement requires system vacuum venting and proper sequence following Applied Materials’documented procedures to ensure system integrity and prevent contamination.

Preventive maintenance includes regular calibration checks of pressure sensors and control valves,verification of board communication integrity,and inspection of electrical connections.The board’s built-in diagnostics provide valuable data for predictive maintenance scheduling.Component-level repair should only be performed by authorized service personnel using genuine Applied Materials components.

We provide comprehensive support for the​​Applied Materials AKT BPSM Board 0190-13883-A Rev.01​​,including technical documentation,installation guidance,and genuine replacement boards.Our support team understands the critical nature of semiconductor tool uptime and offers rapid response to minimize production impacts.